1 8 2 k o a s p e e r e l e c t r o n i c s , i n c . ? 1 9 9 b o l i v a r d r i v e ? b r a d f o r d , p a 1 6 7 0 1 ? u s a ? 8 1 4 - 3 6 2 - 5 5 3 6 ? f a x : 8 1 4 - 3 6 2 - 8 8 8 3 ? w w w . k o a s p e e r . c o m s p e c i f i c a t i o n s g i v e n h e r e i n m a y b e c h a n g e d a t a n y t i m e w i t h o u t p r i o r n o t i c e . p l e a s e c o n f i r m t e c h n i c a l s p e c i f i c a t i o n s b e f o r e y o u o r d e r a n d / o r u s e . 1 / 3 0 / 1 1 l p 7 3 t h i n f i l m r e s i s t a n c e t h e r m a l c h i p s e n s o r f e a t u r e s ? t h i n f i l m t h e r m a l s e n s o r s o f s m d t y p e ? r e s i s t a n c e t o l e r a n c e 1 % , a w i d e r a n g e o f t c r s + 3 0 0 0 x 1 0 - 6 / k ~ + 5 0 0 0 x 1 0 - 6 / k w i t h t h e s t a n d a r d p r o d u c t s ? s u i t a b l e f o r c o n t r o l o f t e m p e r a t u r e s i n v a r i o u s i n d u s t r i a l e q u i p m e n t ? s u i t a b l e f o r b o t h f l o w a n d r e f l o w s o l d e r i n g ? m a r k i n g : b l a c k b o d y c o l o r ? p r o d u c t s w i t h l e a d - f r e e t e r m i n a t i o n s m e e t e u r o h s a n d c h i n a r o h s r e q u i r e m e n t s f o r f u r t h e r i n f o r m a t i o n o n p a c k a g i n g , p l e a s e r e f e r t o a p p e n d i x a . prot ective coating l c w t d inner electro d e solder plating ni plating resis tive film c eramic subst rate c d i m e n s i o n s a n d c o n s t r u c t i o n l . 0 1 6 . 0 0 8 ( 0 . 4 0 . 2 ) . 0 6 3 . 0 0 8 ( 1 . 6 0 . 2 ) . 0 3 1 . 0 0 8 ( 0 . 8 0 . 2 ) . 0 1 2 . 0 0 8 ( 0 . 3 0 . 2 ) . 0 1 2 . 0 0 8 ( 0 . 3 0 . 2 ) . 0 2 . 0 0 4 ( 0 . 5 0 . 1 ) . 0 2 . 0 0 6 ( 0 . 5 0 . 1 5 ) . 0 1 6 . 0 0 8 ( 0 . 4 0 . 2 ) . 0 4 9 . 0 0 8 ( 1 . 2 5 0 . 2 ) . 0 7 9 . 0 0 8 ( 2 . 0 0 . 2 ) 2 a ( 0 8 0 5 ) . 0 2 . 0 1 2 ( 0 . 5 0 . 3 ) . 0 2 . 0 0 6 ( 0 . 5 0 . 1 5 ) . 0 2 . 0 1 2 ( 0 . 5 0 . 3 ) . 0 6 3 . 0 0 8 ( 1 . 6 0 . 2 ) . 1 2 6 . 0 0 8 ( 3 . 2 0 . 2 ) 2 b ( 1 2 0 6 ) wc d t d i m e n s i o n s i n c h e s ( m m ) t y p e 1 j ( 0 6 0 3 ) ( i n c h s i z e c o d e ) t e : 4 m m e m b o s s e d p i t c h p l a s t i c ( 5 , 0 0 0 p i e c e s / r e e l ) 2 s i g n i f i c a n t f i g u r e s + 1 m u l t i p l i e r 3 d i g i t s 1 j : 0 6 0 3 2 a : 0 8 0 5 2 b : 1 2 0 6 t : s n f : 1 % g : 2 % j : 5 % l p 7 3 2 b 3 6 0 0 t s i z e c o d e p r o d u c t c o d e r e s i s t a n c e v a l u e t o l e r a n c e t . c . r . t e r m i n a t i o n m a t e r i a l p a c k a g i n g n e w p a r t # t e 1 0 3 j o r d e r i n g i n f o r m a t i o n eu t h e r m a l p r o t e c t i o n p o w e r r a t i n g r a t e d a m b i e n t t e m p . o p e r a t i n g t e m p . r a n g e a p p l i c a t i o n s a n d r a t i n g s p a r t d e s i g n a t i o n 0 . 0 1 6 w l p 7 3 1 j 0 . 0 3 1 w l p 7 3 2 a 0 . 0 6 3 w + 7 0 c l p 7 3 2 b - 5 5 c t o + 1 2 5 c t h e r m a l t i m e c o n s t a n t ( s e c . ) * t h e r m a l d i s s i p a t i o n c o n s t a n t ( m w / c ) * 2 4 6 . 5 1 . 2 1 . 8 2 . 4 * t h e r m a l t i m e c o n s t a n t a n d d i s s i p a t i o n c o n s t a n t a r e r e f e r e n c e v a l u e s , w h i c h a r e v a l u e s o f e l e m e n t s a n d v a r y w i t h c o n n e c t i n g o r f i x i n g m e t h o d s .
100? - 1k? lp73 thin film resistance thermal chip sensor applications and ratings (continued) resistance tolerance t.c.r. tolerance t.c.r. (ppm/c) max. 100? - 2k? 100? - 10k? resistance range e-24 1j 2a 2b f: 1%, g: 2% j: 5% f: 1% g: 2% j: 5% g: 2%, j: 5% 5% 3000 100?-1k? 100?-300? 330?-1k? 3300 3600 4000 4500 5000 performance characteristics resistance within regulated tolerance t.c.r. +25c/+65c 25c within specified t.c.r. overload rated voltage x 2.5 for 5 seconds 0.5% resistance to solder heat 260c 5c, 10 seconds 1 second rapid change of temperature -55c (30 minutes),+25c (2-3 minutes), +125c (30 minutes), +25c (2-3 minutes), 5 cycles 0.5% endurance at 70c 70c 2c, 1000 hours, 1.5 hours on, 0.5 hours off cycle moisture resistance 40c 2c, 90 - 95% rh, 1000 hours, 1.5 hours on, 0.5 hours off cycle 2.0% derating curve temperature characteristics % rated po wer 100 80 60 40 20 -60 -40 -20 0 4 06 08 01 001 40 70 20 ambien t tempe rature (c) 0 -55 120 125 60 30 0 -10 -50 -25 0 50 100 125 ambient temperature (c) -40 -75 4000ppm/c 20 10 -20 -30 3600ppm/c 3300ppm/c 3000ppm/c resistance changing rate ( %) 25 50 40 4500ppm/c 5000ppm/c t.c.r. (x10 -6 /k) 75 approximate expression for resistance-temperature characteristics c 1 c 2 3000 3300 3600 0.931258 0.00265213 3.90112 x 10 -6 4.00516 x 10 -6 4.34428 x 10 -6 0.924355 0.916356 c 0 t.c.r. (x10 -6 /k) 0.00292569 0.00323714 (values are not guaranteed but typical) r t =r 25 (c 0 +c 1 t+c 2 t 2 ) r t : resistance value at tc r 25 : resistance value at 25c t: ambient temperature (c) c 0 , c 1 , c 2 : constants environmental applications 4000 4500 5000 0.907039 0.00361006 4.33457 x 10 -6 6.05201 x 10 -6 7.48809 x 10 -6 0.897412 0.886014 0.00395222 0.00437224 0.5% 2.0% CC CC 0.3% 0.3% 1.5% 0.3% 1.5% parameter requirement ? r (%+0.05 ?) limit typical test method 183 koa speer electronics, inc. ? 199 bolivar drive ? bradford, pa 16701 ? usa ? 814-362-5536 ? fax: 814-362-8883 ? www.koaspeer.com specifications given herein may be changed at any time without prior notice. please confirm technical specifications before you order and/or use. 6/25/12 confirming resistance drift is recommended since this product has a tendency to have bigger resistance change than general flat chip over 70c. please pay attention not to be applied esd, it may cause of resistance change. test items high temperature exposure 125c, 1000 hours 8.0% reference test method esd human model, 100 pf 1.5 k ? 500v actual value (out of guarantee) thermal protection
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